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Coolpad Works with Qualcomm to Advance 5G

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Marketing
January 7, 2020

New collaboration will enable Coolpad to provide affordable 5G devices to every member of the family

LAS VEGAS – January 7, 2020 – Global consumer electronics company Coolpad , today announced that it is working closely with Qualcomm Technologies, Inc. to build out its 5G device offerings. With a strong commitment to the Qualcomm® Snapdragon™ 765 5G Mobile Platform , Coolpad is building out a research and design team with 5G testing equipment that will power next-generation products.

“Qualcomm Technologies is a clear leader in 5G technology, and we are excited to be working with them as we continue our product innovation,” said Steve Cistulli, CEO, Coolpad Americas. “Coolpad has made a significant investment in the technology needed to deliver affordable 5G mobile and IoT devices to our family-focused customers. We look forward to releasing our newest 5G products in 2020.”

By developing cost-effective 5G offerings, Coolpad will provide entirely new connected experiences that will improve how we communicate – making connections faster, more reliable and more immersive. As a part of this collaboration, Coolpad will utilize the Snapdragon 765 5G Mobile Platform.

About Coolpad

Coolpad Americas is a top consumer electronics company that has built strategic partnerships with key wireless carriers and retailers. Operating in the U.S. market since 2012, Coolpad has embarked on a bold mission to become the number one provider of family technology. Coolpad develops world-class consumer electronics that are inspired by innovation, purpose, and family. To learn more about Coolpad, please visit www.coolpad.us.

 

Media Contact

Erin Lumley

mPR, Inc. for Coolpad

erin@mpublicrelations.com

(925) 899-1355 direct

Customer Service: 1 (877) 606-5753

 

Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United

States and other countries. Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. and/or its subsidiaries.